Gerber will be unveiling a new brushing technology that is claimed to make cutting edge preparation much more economical. The system can be used both dry and wet with the addition of oil. As opposed to the established diamond brushes, the brush is characterized by a high temperature resistance of up to 160°. The homogeneous distribution of the diamond grains over the entire bristle and the high grain content give the brush a very high polishing performance. The new system has already been introduced by various tool manufacturers and is said to yield very good results when rounding HM, CBN and PCD inserts. In tests with the new brush, an exact radius of 0.02 mm was able to be measured after only a few minutes of machining time. The life of the brush is very high as the new carrier material can bind the diamond grains longer than a plastic-based bristle. The company particularly points up the shorter processing times, the lesser extent of soiling, and the constant diamond saturation.
Cutting edge preparation with new brush technology
The BP-MX system together with the Diaflex brush technology is said to open up new possibilities in cutting edge preparation. Shorter machining times, less soiling and constant diamond saturation are the parameters reportedly necessary for process automation.